Member of Technical Staff (MTS) – Process Development, Thin Films (CVD/Diffusion), NAND

In breve

Micron Technology, a global leader in memory and storage innovation, is seeking a Member of Technical Staff (MTS) to advance its NAND Advanced Thin Films program. The role focuses on developing and optimizing dielectric and carbon‑based thin‑film processes, primarily using chemical vapor deposition (CVD) and diffusion techniques, to support the company's vision of transforming information use worldwide. On a daily basis the MTS will lead project‑level initiatives that span structural and electrical film development. Responsibilities include designing and executing complex experiments, performing material characterization with tools such as ellipsometry, X‑ray reflectivity, SEM and TEM, and delivering measurable results that improve integration, defect density and yield. The engineer will also support technology transfer and ramp‑up activities, maintain detailed records, author technical reports, and contribute to standard operating procedures and knowledge‑management systems. In addition, the role involves mentoring junior engineers, applying AI‑assisted tools to enhance efficiency, and participating in cross‑functional problem‑solving to drive continuous improvement. The position requires deep technical expertise in thin‑film deposition and metrology. Candidates must have a PhD with at least eight years, a Master's with at least eleven years, or a Bachelor's with at least thirteen years of relevant experience in electrical engineering, materials science, chemical engineering, physics or a related discipline, specifically with significant R&D or process development work on NAND diffusion and CVD films. Core technical skills include hands‑on experience with ALD and both plasma and thermal CVD, recipe development and troubleshooting, and proficiency with fab metrology equipment. Strong capabilities in root‑cause analysis, design of experiments, statistical process control, and clear technical communication are also mandatory. Soft‑skill expectations cover project leadership, cross‑functional collaboration, and the ability to coach and mentor less‑experienced team members. Preferred qualifications include a record of publications or patents and a demonstrated history of technical contributions. Micron values its core principles, respect, innovation, tenacity, collaboration and customer focus, and expects the candidate to embody these in daily work. The role is part of a European talent pipeline that may lead to international mobility or relocation, with the specific site to be disclosed during the interview process. Compensation ranges from €75,000 to €132,000 annually, plus a variable plan, meal vouchers, remote‑work allowances, supplemental health and life coverage, and other benefits as outlined in Micron's EMEA benefits package. What the role asks for: - PhD + ≥ 8 years relevant experience, or Master's + ≥ 11 years, or Bachelor's + ≥ 13 years - Significant NAND thin‑film R&D/PD experience (diffusion and CVD) - Expertise in ALD and CVD (plasma & thermal) deposition - Proficiency with ellipsometry, XRR, SEM, TEM metrology tools - Knowledge of integration, defect, yield improvement (RCA, DOE, SPC) - Strong written and verbal technical communication - Project‑level leadership and cross‑functional collaboration - Coaching/mentoring ability for early‑career engineers - Nice‑to‑have: publications or patents demonstrating technical impact